EM3 provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the international electronics industry. Our in-house capabilities include:

Assembly Facilities

• Leaded and lead free processing.

• High speed automatic SMT pick and place

• Fully automated solder paste printer with built in AOI

• Fine Pitch QFP to 0.5mm.

• BGA to 0.5mm.

• Chip components 0201.

• Through Hole Assembly Lines.

• Dual Wave, Wave Soldering machine.

• Mechanical and box build assembly.

Testing

• MDA (manufacturing defects analysis) testing.

• Full functional testing using dedicated Jigs and fixtures.

• X-Ray and Optical inspection facility for BGA placement.

• PC based test systems (Dedicated, JTAG/Boundary Scan).

• Flying Probe testing

Turnkey Product Manufacturing

• Project management and complete product life-cycle management.

• Packaging and warehousing.

Other Services

• Design advice on suitability for manufacture (DFM).

• Engineering support including PCB layouts and design.

• Production tooling and test jig design and manufacture.